Non-woven fabric pad "SUBA(TM)"
Versatile and easy-to-use non-woven fabric pads.
"SUBA(TM)" is a non-woven pad that demonstrates high performance, stability, and reliability as a polishing pad compatible with various types of substrates, from silicon wafers and glass substrates to GaN and SiC substrates. It achieves an ideal polishing finish with a wide lineup that can accommodate various applications. We respond to various requests, including hard types that emphasize flatness and soft types that focus on planarity. 【Features】 ■ A non-woven pad characterized by a high polishing rate, used for a wide range of polishing targets ■ More than 10 standard types available ■ High hardness and high density pads improve finishing flatness ■ Low hardness and low density pads reduce defects *For more details, please download the PDF or feel free to contact us.
- Company：アンカーテクノ
- Price：Other
